详情
特点
- Line times down to 20 µs, or 15 µs in ADC low-OSR mode
- Binning mode (half the number of effective channels) for faster readout speed down to 10 µs
- Selectable parameters: input charge range, holes or electrons polarity, detector timing, low-pass filter time constant and line time
- Up to three different internal charge pump cycles for offset adjusting, signal emulation and switch charge injection compensation
- Four power modes in addition to sleep and full power-down modes
- Correlated Double Sampling for offset subtraction with programmable time constant
优势
- Flexible programming options to optimize for application needs
- Suitable to a wide range of detector sizes, supporting line capacitances up to 200 pF
- Best-in-class figure of merit for noise, power consumption and speed
- High-speed for dynamic applications
- Ultra-low power for portable applications
- Low-noise for great image quality
- Accurate temperature feedback
- Chip-on-flex packaging suitable to ACF bonding on the detector side and to a low-cost standard connector on the PCB side
产品参数
通道
输入
256
Integration time
最小值
15
µs
Input related noise
典型值
500
Power consumption per channel
最小值
3.1
mW
分辨率
16
bit
封装
chip-on-flex (ACF bonding + standard connector)
Function
x-ray sensing
下载
产品规格书
Short datasheet
技术文档
Factsheet
环境文档
RoHS certificate
产品查询
寻找合适的产品
更多 计算机断层扫描ct与x射线传感器
借助高品质的传感解决方案,CT与X射线传感器设备能够以更高对比度呈现更精确的图像,同时限制了噪点和失真的出现。