OSRAM Advanced Power TOPLED™, LR G6SP.02

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描述

新一代Advanced Power TOPLED.02 (APT.02) 采用艾迈斯欧司朗最先进的PLCC 6 封装，该封装在中功率 LED产品领域树立了行业标准，并且在过去的几十年前中作为主流的车规级封装被广为使用。APT.02 系列凭借其稳定且坚固的设计，即使在严苛的使用环境条件下也能提供高水平的光电性能。APT.02 系列产品使用了我们最新的InGaAlP芯片技术，以保证其优异的亮度性能，超高的发光效率及出色的散热能力。
产品规格书
LR G6SP.02
English
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中文
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LR G6SP.02 - Dual binning
English
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中文
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详情

产品参数

发射颜色
Red (612-630 nm)
电功率
0.31 W
Mid
亮度
ΦV 典型值
24.3 lm
IV 典型值
8.15 cd
ΦE 典型值
138 mW
IE 典型值
46.3 mW/sr
光束角
∢ 典型值
120 °
工作温度
Top 最小值
-40 °C
Top 最大值
125 °C
尺寸
l 典型值
3.3 mm
w 典型值
3.4 mm
h 典型值
1.9 mm
设备资质
AEC-Q102

订购信息

产品类别 描述 订购代码 可行
LR G6SP.02-8D7E-46-G3R3-140 Iv = 6.3 ... 10.0 cd (IF = 140 mA) Q65113A3563 量产中
LR G6SP.02-U1V2-1-A3D3+8D7E-46-G3R3 Iv = 450 ... 1120 mcd (IF = 10 mA)
Iv = 6.3 ... 10.0 cd (IF = 140 mA) 		Q65113A4698 量产中

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产品规格书
LR G6SP.02 · Datasheet · PDF · en_US
LR G6SP.02 - Dual binning · Datasheet · PDF · en_US

应用说明
Driving the Advanced Power TOPLED® · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
LED driving technology for long term flexibility · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

资源
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

图片
APT.02 product picture · Images · TIF

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