OSRAM Power TOPLED™, LY E6SF.01

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描述

PowerTOPLED® 作为 PLCC 封装系列的标杆产品，凝聚多年技术积淀与市场认可，现已全面升级。专为汽车尾灯组（如刹车灯、转向灯）量身定制。 PowerTOPLED®.01 作为该系列全新一代产品，搭载艾迈斯欧司朗最新铟镓砷芯片技术。新一代产品中，首发型号为树脂浇注封装的 Lx E67F.01；后续采用硅胶封装的 Lx ETSF.01 与 Lx E6SF.01 两款型号也已陆续推出。
产品规格书
LY E6SF.01
English
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中文
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详情

特点

  • Corrosion Robustness Class: 3B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
  • Can be used in harsh environment applications (automotive exterior, AEC-Q102)
  • Package size identical to old generation
  • Solder pad identical to old generation
  • Industry standard PLCC4 package (established by ams OSRAM)
  • Available in the color amber, red, superred and yellow

优势

  • Price competitiveness
  • Latest chip technologies deliver excellent performance
  • Easy switch from old to new generation

产品参数

发射颜色
Yellow (580-595 nm)
电功率
0.11 W
Low
亮度
ΦV 典型值
8.61 lm
IV 典型值
2.93 cd
ΦE 典型值
17.2 mW
IE 典型值
5.85 mW/sr
ΦP 典型值
0.0145 µmol/s
光束角
∢ 典型值
120 °
工作温度
Top 最小值
-40 °C
Top 最大值
110 °C
尺寸
l 典型值
3.2 mm
w 典型值
2.8 mm
h 典型值
1.9 mm
设备资质
AEC-Q102

订购信息

产品类别 描述 订购代码 可行
LY E6SF.01-7B8C-36-G3R3 Iv = 2240 ... 4500 mcd (IF = 50 mA) Q65113A8816 量产中

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产品规格书
LY E6SF.01 · Datasheet · PDF · en_US

应用说明
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

资源
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

图片
Power TOPLED Lx E6SF · Images · TIF

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