详情
特点
- 搭载直接飞行时间(ToF)技术,采用高灵敏度SPAD,实现光信号检测;具有3×3多点配置,支持多目标检测;具有可调视场角(可达63°的对角线);快速时间-数字转换器(TDC)结构;具备亚纳秒光脉冲;在30Hz时,可在10–5000mm范围内进行距离传感;内置片上直方图处理功能;配备940nm VCSEL,符合 1级人眼安全标准;高性能片上阳光抑制滤光片和算法;采用小型模块化OLGA封装,尺寸为2.0mm×4.6mm×1.4mm
优势
- 提供高信噪比、宽动态范围,并且无多径反射;在±5%范围内实现黑暗和阳光环境距离测量;可调节FoV,实现自定义场景匹配;提供同类最佳分辨率的测距模式检测传感;实现准确的距离测量;提供高精度、更大的玻璃盖板间距、动态玻璃盖板校准、污垢或污点去除和串扰补偿;具备人眼安全电路,在VCSEL发生故障时,可以停止VCSEL驱动器;配备光学滤波片,具有算法支持,可实现高度的环境光适应性;减少电路板空间需求,在有限空间内实现薄型系统设计,增强工业设计的灵活性
产品参数
传感器区域
multi
检测区域数量
9
检测距离
最大值
500
cm
晶圆级光学滤波器
Yes
视角
63
°
工作环境温度
最小值
-40
°C
最大值
85
°C
电源电压
最小值
2.7
V
最大值
3.5
V
典型值
3.0
V
波长
940 nm
封装
OLGA12
封装尺寸
l
典型值
4.6
mm
w
典型值
2.0
mm
h
典型值
1.4
mm
接口
输入
I²C
输出
I²C
Live Webinar: High-Resolution Multi-Zone Sensing with the TMF8829 dToF Sensor
Discover how precise 3D depth sensing can improve presence detection and spatial awareness in real-world designs, from robotics and logistics to mobile, wearables and other smart appliances.
What you’ll gain:
- A clear introduction to direct Time-of-Flight sensing technology
- A deep dive in multi-zone dToF 3D depth sensing with insight into the TMF8829 sensor: up to 48×32 pixels, 11 m range, and 80° field of view
- Understanding of on-chip processing for distance, confidence, and ambient light data
- Examples of multi-object detection and AI-ready depth data in practice
Where it’s used:
- Depth-based object detection and scene mapping
- Gesture control for headphones and wearables
- Smart appliances such as lawn movers or coffee machines
- Industrial robotics, logistics, and camera autofocuus
Subscribers will get access to additional technical resources. Take your chance to talk to our expert David Smith in our live webinar on January 14, 2026.
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