详情
特点
- 光学格式为1/2.7”
- 分辨率达1600×1400
- 8/10/12位深度
- 采用2.79μm全局快门像素技术
- 在940nm处具有高灵敏度的同类领先QE
- 具备数字CDS和行噪声校正功能
- 内置片上缺陷像素检测和校正
- 支持片上图像统计生成
- 低功耗
- 提供单色、RGB和RGBIR三种颜色可选
优势
- 器件体积小巧，具有高分辨率和高位深
- 搭载近红外增强技术，灵敏度高
- 内置片上降噪功能
- 减少片外处理
- 延长电池运行时间
- 在弱光条件下表现卓越，是理想的选择
产品参数
分辨率
2.2
MP
Shutter type
Global
Frame rate
最大值
90
fps
Optical format
1/2.7"
Pixel pitch
2.79
µm
2.79
µm
Function
area scan
CRA
Yes
封装
CSP
封装尺寸
h
典型值
0.74
mm
l
典型值
5.4
mm
w
典型值
5.4
mm
Cover glass
Anti-reflective coating
CFA option
Mono
RGB
RGBIR
ADC mode
8
bit
10
bit
12
bit
通道
输出
2
接口
输出
I²C
Output interface speed
1500
Mbps
订单代码
下载
相关评估板、套件和附件
ams MIRA_EVM_SN_RASPBERRY Evaluation kit
The Mira Raspberry Pi evaluation kit is a Raspberry Pi 4B based platform for evaluating the Mira product family of image sensors.
ams MIRA220_PARTNER_APPLEYE_SENSOR_MODULE Evaluation kit
Fully integrated Mira-220 image sensor with MIPI interface and fixed focus field-of-view (FoV) of D74° / H59° / V52° by partner Appleye. As default the image sensor module is provided in spectral option ‘MONO’, but can be easily modified to ‘RGB’ / ‘RGB-IR’ or different lens option.
Link to external partner website:
https://appleye.co.il/product/ae-ccm-gs-mira220-m-59/
ams MIRA220_PARTNER_TEKNIQUE_3DREFDESIGN Reference design kit
Full featured 3D vision reference design kit based on Oclea CV25 µSoM with Ambarella™ CV25 ISP with active stereo vision, structured light and embedded flood illumination by partner Teknique.
Link to external partner website:
https://oclea.com/assets/Products/Oclea_PB-3DDepthRDK_1.2.pdf
ams MIRA220_PARTNER_ARDUCAM_EVALKIT Evaluation kit
Developed by our partner ArduCam, the ArduCam Mira Series NIR Enhanced USB3.0 evaluation kit, unleashes the complete potential of the Mira220 image sensor, allowing customers to effortlessly witness the transformative difference it brings to the application.
Link to external partner website:
https://www.arducam.com/introducing-arducams-partnership-with-ams-osram/
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ams Mira016 CMOS Image Sensor
Mira016 is a compact 0.16MP Near IR enhanced global shutter image sensor designed for 2D and 3D consumer and industrial machine vision applications. The sensor has a small 2.79 µm pixel size with high sensitivity made possible by a state of the art BSI technology. The sensor has a MIPI CSI-2 interface to allow easy interfacing with a plethora of processors and FPGAs. With its small 1.8mm x 1.8mm size, configurability and high sensitivity both in visual as well as NIR wavelengths, the Mira016 is well suited for many 2D and 3D applications, including eye tracking in ARVR. Low active power and high sensitivity in NIR enables increased measurement range as well as overall system power consumption optimization which is key for battery powered consumer and industrial applications.
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