详情
特点
- 光学格式为1/2.7”
- 分辨率达1600×1400
- 8/10/12位深度
- 采用2.79μm全局快门像素技术
- 在940nm处具有高灵敏度的同类领先QE
- 具备数字CDS和行噪声校正功能
- 内置片上缺陷像素检测和校正
- 支持片上图像统计生成
- 低功耗
- 提供单色、RGB和RGBIR三种颜色可选
优势
- 器件体积小巧，具有高分辨率和高位深
- 搭载近红外增强技术，灵敏度高
- 内置片上降噪功能
- 减少片外处理
- 延长电池运行时间
- 在弱光条件下表现卓越，是理想的选择
产品参数
分辨率
2.2
MP
快门类型
Global
帧率
最大值
90
fps
光学尺寸
1/2.7"
像素尺寸
2.79
µm
2.79
µm
功能
面扫描
CRA
Yes
封装
CSP
封装尺寸
h
典型值
0.74
mm
l
典型值
5.4
mm
w
典型值
5.4
mm
保护玻璃
Anti-reflective coating
滤色阵列选项
Mono
RGB
RGBIR
模数转换模式
8
bit
10
bit
12
bit
通道
输出
2
接口
输出
I²C
输出接口速率
1500
Mbps
订购信息
| 产品类别 | 描述 | 订购代码 | 可行 |
|---|---|---|---|
| Mira220-2QC1D0 RW | RGB, reconstructed wafer (bare die) | Q65113A5399 | 量产中 |
| Mira220-2QC1WA FT SE | RGB, CSP, AR coated glass, with protective film | Q65113A5404 | 量产中 |
| Mira220-2QC1WO FT SE | RGB, CSP, plain glass, no protective film | Q65113A5405 | 量产中 |
| Mira220-2QC1WP FT SE | RGB, CSP, plain glass, with protective film | Q65113A5403 | 量产中 |
| Mira220-2QI1D0 RW | RGB-IR, reconstructed wafer (bare die) | Q65113A5406 | 量产中 |
| Mira220-2QI1WA FT SE | RGB-IR, CSP, AR coated glass, with protective film | Q65113A5409 | 量产中 |
| Mira220-2QI1WO FT SE | RGB-IR, CSP, plain glass, no protective film | Q65113A5410 | 量产中 |
| Mira220-2QI1WP FT SE | RGB-IR, CSP, plain glass, with protective film | Q65113A5408 | 量产中 |
| Mira220-2QM1D0 RW | Mono, reconstructed wafer (bare die) | Q65114A0085 | 量产中 |
| Mira220-2QM1WA FT SE | Mono, CSP, AR coated glass, with protective film | Q65114A0087 | 量产中 |
| Mira220-2QM1WO FT SE | Mono, CSP, plain glass, no protective film | Q65113A5069 | 量产中 |
| Mira220-2QM1WP FT SE | Mono, CSP, plain glass, with protective film | Q65114A0086 | 量产中 |
下载
相关评估板、套件和附件
ams MIRA_EVM_SN_RASPBERRY Evaluation kit
The Mira Raspberry Pi Evaluation Kit is a Raspberry Pi 4B-based platform designed for evaluating the Mira family of image sensors. Sensor boards featuring RGB or RGB-IR sensors can be ordered separately.
For the Mira220 sensor board, click here
For the Mira050 sensor board, click here
For the Mira016 sensor board, click here
ams MIRA220_PARTNER_APPLEYE_SENSOR_MODULE Evaluation kit
Fully integrated Mira-220 image sensor with MIPI interface and fixed focus field-of-view (FoV) of D74° / H59° / V52° by partner Appleye. As default the image sensor module is provided in spectral option ‘MONO’, but can be easily modified to ‘RGB’ / ‘RGB-IR’ or different lens option.
Link to external partner website:
https://appleye.co.il/product/ae-ccm-gs-mira220-m-59/
ams MIRA220_PARTNER_TEKNIQUE_3DREFDESIGN Reference design kit
Full featured 3D vision reference design kit based on Oclea CV25 µSoM with Ambarella™ CV25 ISP with active stereo vision, structured light and embedded flood illumination by partner Teknique.
Link to external partner website:
https://oclea.com/assets/Products/Oclea_PB-3DDepthRDK_1.2.pdf
ams MIRA220_PARTNER_ARDUCAM_EVALKIT Evaluation kit
Developed by our partner ArduCam, the ArduCam Mira Series NIR Enhanced USB3.0 evaluation kit, unleashes the complete potential of the Mira220 image sensor, allowing customers to effortlessly witness the transformative difference it brings to the application.
Link to external partner website:
https://www.arducam.com/introducing-arducams-partnership-with-ams-osram/
ams MIRA220_EVM_SE Reference design kit
Mira220 sensor board compatible with Mira Raspberry Pi evaluation kit.
相关产品
艾迈斯 Mira050 CMOS图像传感器
Mira050是一款紧凑型0.5MP近红外增强全局快门图像传感器，专为2D和3D消费类和工业机器视觉应用而设计。该传感器的像素尺寸小巧，为2.79 µm，采用最先进的BSI技术，灵敏度高。该传感器具有MIPI CSI-2接口，便于与众多处理器和FPGA轻松连接。由于其尺寸小巧、具有可配置性以及在可见光和近红外方面灵敏度高，Mira050非常适用于2D和3D应用，包括主动立体视觉、结构光视觉和AR/VR。近红外灵敏度高，可扩大测量范围，优化整个系统的功耗，这对电池供电的消费类和工业应用至关重要。
艾迈斯 Mira016 CMOS Image Sensor
Mira016是一款紧凑型16万像素(400*400)的近红外增强全局快门图像传感器，专为2D和3D消费级及工业级机器视觉应用设计。该传感器采用2.79微米像元尺寸，借助先进的背照式技术(BSI)实现高灵敏度，并配备MIPI CSI-2接口，可轻松连接各类处理器和FPGA。凭借1.8mm×1.8mm小尺寸、灵活可配置性及可见光与近红外波长区域的高灵敏度，Mira016能完美适配多种2D/3D应用场景，包括ARVR中的眼动追踪。其近红外高灵敏度和低工作功耗特性，可有效扩大测量距离并优化系统整体能耗，这对电池供电的消费类和工业应用具有关键意义。
产品查询
寻找合适的产品
更多 CMOS图像传感器芯片
CMOS图像传感器芯片具有外观小巧、灵敏度高、经济节能、小尺寸等特点。